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product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays. 1/19 tsz02201-0t2t0an00090-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 14? 001 21.feb.2013 rev.001 datashee t single-output ldo regulator 1a fixed output ldo regulators BD80C0AFPS-M bd90c0afps-m general description the BD80C0AFPS-M and bd90c0afps-m are low-saturation regulators. these ics have built in over current protection to protect the device when output is shorted and thermal shutdown circuit to protect the device during over load conditions. features ? output current capability : 1a ? high output voltage precision: 1% ? low saturation with pdmos output ? built-in over-current prot ection circuit that prevents the destruction of the ic due to output short circuits ? built-in thermal shutdown circuit for protecting the ic from thermal damage due to overloading ? low esr capacitor applications audiovisual equipments, fpds, televisions, personal computers or any other consumer device key specification ? supply voltage range: vo+1.0v to 26.5v ? output voltage BD80C0AFPS-M: 8.0v bd90c0afps-m: 9.0v ? output current: 1a ? operating temperature range: -40 ta +105 package w (typ.) x d (typ.) x h (max.) to252s-3 6.50mm x 9.50mm x 1.30mm typical application circuit ordering information b d x x c 0 a f p s - e 2 part number output voltage 80:8.0v output 90:9.0v output current capacity c0a:1a package fps:to252s-3 packaging and forming specification e2: embossed tape and reel lineup maximum output current (max.) output voltage (typ.) package orderable part number 1a 8.0v to252s-3 reel of 2000 BD80C0AFPS-M -e2 9.0v bd90c0afps-m -e2 to252s-3 figure 1. typical application circuit vcc gnd vo cout cin vcc
datasheet datasheet 2/19 tsz02201-0t2t0an00090-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.feb.2013 rev.001 BD80C0AFPS-M bd90c0afps-m pin configuration pin description pin no. symbol function 1 vcc power supply pin 2 n.c. n.c. pin 3 vo output pin fin gnd gnd n.c.pin can be open. because it isn't connect it inside of ic. block diagram figure 2. pin configuration to252s-3 (top view) figure 3. block diagram vref: bandgap reference ocp: over current protection circuit tsd: thermal shut down circuit driver: power transistor driver
datasheet datasheet 3/19 tsz02201-0t2t0an00090-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.feb.2013 rev.001 BD80C0AFPS-M bd90c0afps-m absolute maximum ratings (ta=25 ) parameter symbol ratings unit supply voltage *1 v cc -0.3 to +35.0 v power dissipation *2 pd 1.2 w operating temperature ra nge topr -40 to +105 storage temperature range tstg -55 to +150 maximum junction temperature tjmax +150 *1 not to exceed pd. *2 to252s-3:reduced by 9.6mw / c over ta = 25c, when mounted on glass epoxy board: 70mm 70mm 1.6mm. recommended operating ratings (ta=25 ) BD80C0AFPS-M parameter symbol min. max. unit supply voltage v cc 9.0 26.5 v output current io 0 1.0 a bd90c0afps-m parameter symbol min. max. unit supply voltage vcc 10.0 26.5 v output current io 0 1.0 a electrical characteristics BD80C0AFPS-M (unless otherwise specified, ta=25 , vcc=13v, io=0ma) parameter symbol guaranteed limits unit conditions min. typ. max. circuit current ib 0.6 1.0 ma output voltage vo 7.92 8.00 8.08 v io=500ma dropout voltage vd 0.3 0.5 v v cc =vo 0.95, io=500ma ripple rejection r.r. 40 50 db f=120hz,ein *1 =1vrms, io=100ma line regulation reg.i 20 60 mv v cc =9 25v load regulation reg.l vo0.010 vo0.015 v io=5ma 1a temperature coefficient of output voltage tcvo.1 +0.04 %/ io=5ma,tj=-40 to -20 tcvo.2 0.005 %/ io=5ma,tj=-20 to +105 *1 ein: input voltage ripple bd90c0afps-m (unless otherwise specified, ta=25 , vcc=14v, io=0ma) parameter symbol guaranteed limits unit conditions min. typ. max. circuit current ib 0.6 1.0 ma output voltage vo 8.91 9.00 9.09 v io=500ma dropout voltage vd 0.3 0.5 v v cc =vo 0.95, io=500ma ripple rejection r.r. 40 50 db f=120hz,ein* 1 =1vrms, io=100ma line regulation reg.i 20 60 mv v cc =10 25v load regulation reg.l vo0.010 vo0.015 v io=5ma 1a temperature coefficient of output voltage tcvo.1 +0.04 %/ io=5ma,tj=-40 to -20 tcvo.2 0.005 %/ io=5ma,tj=-20 to +105 *1 ein: input voltage ripple
datasheet datasheet 4/19 tsz02201-0t2t0an00090-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.feb.2013 rev.001 BD80C0AFPS-M bd90c0afps-m figure 4. circuit current figure 5. line regulation (io=0ma) figure 7. load regulation figure 6. line regulation (io=500ma) typical performance curves BD80C0AFPS-M (unless otherwise specified, ta=25 , vcc=13v, io=0ma)
datasheet datasheet 5/19 tsz02201-0t2t0an00090-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.feb.2013 rev.001 BD80C0AFPS-M bd90c0afps-m figure 8. dropout voltage (vcc=vo 0.95v) (lo=0ma 1000ma) figure 9. ripple rejection (io =100ma) figure 10. output voltage temperature characteristic figure 11. circuit current (lo=0ma 1000 ma) typical performance curves - continued
datasheet datasheet 6/19 tsz02201-0t2t0an00090-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.feb.2013 rev.001 BD80C0AFPS-M bd90c0afps-m figure 12. thermal shutdown circuit characteristic typical performance curves - continued
datasheet datasheet 7/19 tsz02201-0t2t0an00090-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.feb.2013 rev.001 BD80C0AFPS-M bd90c0afps-m figure 13. circuit current figure 14. line regulation (io=0ma) figure 15. line regulation (io=500ma) figure 16. load regulation typical performance curves - continued bd90c0afps-m (unless otherwise specified, ta=25 , vcc=14v, io=0ma)
datasheet datasheet 8/19 tsz02201-0t2t0an00090-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.feb.2013 rev.001 BD80C0AFPS-M bd90c0afps-m figure 17. d r opout voltage (vcc=vo 0.95v) (lo=0ma 1000ma) figure 18. ripple rejection (io=100ma) figure 19. output voltage temperature characteristic figure 20. circuit current (lo=0ma 1000 ma) typical performance curves - continued
datasheet datasheet 9/19 tsz02201-0t2t0an00090-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.feb.2013 rev.001 BD80C0AFPS-M bd90c0afps-m figure 21. thermal shutdown circuit characteristic typical performance curves - continued
datasheet datasheet 10/19 tsz02201-0t2t0an00090-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.feb.2013 rev.001 BD80C0AFPS-M bd90c0afps-m measurement circuit for typical performan ce curves (BD80C0AFPS-M and bd90c0afps-m) measurement circuit of figure 4 and figure 13 measurement circuit of figure 5 and figure 14 measurement circuit of figure 6 and figure 15 measurement circuit of figure 7 and figure 16 measurement circuit of figure 8 and figure 17 measurement circuit of figure 9 and figure 18 measurement circuit of figure 10 and figure 19 measurement circuit of figure 11 and figure 20 measurement circuit of figure 12 and figure 21 vcc gnd vo 1 f vcc gnd vo 1 f vcc gnd vo 1 f v a v 1 f 1 f 1 f vcc gnd vo 1 f vcc gnd vo 1 f vcc gnd vo 1 f a a v 100 m a 1vrms 1 f 1 f 1 f a vcc gnd vo 1 f 1 f vcc gnd vo 1 f v 500 m a 1 f vcc gnd vo 1 f v 1 f
datasheet datasheet 11/19 tsz02201-0t2t0an00090-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.feb.2013 rev.001 BD80C0AFPS-M bd90c0afps-m v cc gnd v cc gnd application examples ? positive voltage surges on v cc pin a power zener diode should be inserted between v cc and gnd for protection against voltage surges of more than 35v on the v cc pin. ? negative voltage surges on v cc pin a schottky barrier diode should be inserted between v cc and gnd for protection against voltages lower than gnd on the v cc pin. ? output protection diode loads with large inductance components may cause reverse curre nt flow during startup or shutdown. in such cases, a protection diode should be inserted on the output to protect the ic. vo figure 22. figure 23. figure 24.
datasheet datasheet 12/19 tsz02201-0t2t0an00090-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.feb.2013 rev.001 BD80C0AFPS-M bd90c0afps-m power dissipation mounted on a rohm standard board board size : 70mm 70 mm 1.6 mm copper foil area :7mm 7mm to252s-3 ja=104.2( /w) ic mounted on a rohm standard board board size 70mm70mm1.6mm copper area 7mm7mm :2-layer pcb (copper foil area on the reverse side of pcb:15mm15mm) :2-layer pcb (copper foil area on the reverse side of pcb:70mm70mm) :4-layer pcb (copper foil on the reverse side of pcb:70mm70mm) : ja=67.6 /w : ja=35.7 /w : ja=26.0 /w figure 25. to252s-3 1.20 0 1 2 3 4 5 0 255075100125150 power dissipation: pd (w) ambient temperatue: ta( ) 4.80 3.50 1.85 0 1 2 3 4 5 0 25 50 75 100 125 150 power dissipation: pd (w) ambient temperatue: ta( ) figure 26. to252s-3
datasheet datasheet 13/19 tsz02201-0t2t0an00090-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.feb.2013 rev.001 BD80C0AFPS-M bd90c0afps-m when used at temperatures over ta=25 , please refer to the power dissipation curve shown in figure 25 and figure 26. the ic characteristics are closely related to the temperature at which the ic is used, so it is necessary to operate the ic at temperatures less than the maximu m junction temperature tjmax. figure 25 and figure 26 show the acceptable power dissipation curve of the to252s-3 package. even when the ambient temperature ta is at normal temperature (25 ), the chip (junction) temperature tj ma y be quite high, so please operate the ic at temperature less than the acceptable power dissipation pd. the calculation method for power consumption pc(w) is as follows :(figure 26 ) pc= (vcc vo) io+vccib acceptable loss pd pc solving this for load current io in order to o perate within the acceptable power dissipation, (please refer to figure 11, figure 20 for ib.) it is then possible to find the maximum load current io max with respect to the applied voltage vcc at the time of thermal design. calculation example for BD80C0AFPS-M) when ta=85 , vcc=13v, vo=8v please refer to the above information and keep thermal desig ns within the scope of acceptable loss for all operating temperature ranges. the power consumption pc of the ic when there is a short circuit (short between vo and gnd) is : pc=vcc (ib + ishort) (please refer to figure 7,figure 16 for ishort.) input / output equivalent circuit diagrams r 1 (k) r 2 (k) r 3 (k) BD80C0AFPS-M 5 48.3 20 bd90c0afps-m 55 io pd vccib vcc vo vcc: vo: io: ib: ishort: input voltage output voltage load current circuit current short current figure 26 : ja=26.0 /w -38.4mw/ 25 =4.80w 85 =2.496w io 2.496 13ib 5 io 497.6ma (ib: 0.6 ma) vcc vo r 3 r 2 r 1 vcc terminal vo terminal vcc ic
datasheet datasheet 14/19 tsz02201-0t2t0an00090-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.feb.2013 rev.001 BD80C0AFPS-M bd90c0afps-m operational notes 1. absolute maximum ratings exceeding the absolute maximum rating for supply voltage, oper ating temperature or other parameters can result in damages to or destruction of the chip. in this event it also becomes impossible to det ermine the cause of the damage (e.g. short circuit, open circuit, etc). therefore, if any specia l mode is being considered with values expected to exceed the absolute maximum ratings, implementing physical safety measures, such as adding fuses, should be considered. 2. the electrical characteristics given in this specification may be influenced by conditions such as temperature, supply voltage and external components. transient characteristics should be sufficiently verified.. 3. gnd electric potential keep the gnd pin potentia l at the lowest (minimum) level under any oper ating condition. furthermore, ensure that, including the transient, none of the pin?s voltages are less than the gnd pin voltage. 4. ground wiring pattern when both a small-signal gnd and a high curr ent gnd are present, single-point gr ounding (at the set standard point) is recommended. this in order to separate the small-signal and high current patterns and to ensure that voltage changes stemming from the wiring resistance and high current do not caus e any voltage change in the small-signal gnd. similarly, care must be taken to avoid wiring pattern fluct uations in any connected external component gnd. 5. inter-pin shorting and mounting errors ensure that when mounting the ic on the pcb the direction and position are correct. incorrect mounting may result in damaging the ic. also, shorts caused by dust entering betw een the output, input and gnd pin may result in damaging the ic. 6. operation under str ong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 7. inspection using the set board the ic needs to be discharged after each inspection process as, while using the set board for inspection, connecting a capacitor to a low-impedance pin may cause stress to the ic. as a protection from static electricity, ensure that the assembly setup is grounded and take sufficient caution with tr ansportation and storage. also, make sure to turn off the power supply when connecting and disconnecting the inspection equipment. 8. power dissipation (pd) should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 9. thermal design the power dissipation under actual oper ating conditions should be taken into consideration and a sufficient margin should be allowed for in the thermal design. on the reverse side of the package this product has an exposed heat pad for improving the heat dissipation. use both the front and reverse side of the pcb to increase the heat dissipation pattern as far as possible. the amount of heat generated depends on the voltage difference across the input and output, load current, and bias current. therefore, when actually using the chip, ensure that the gener ated heat does not exceed the pd rating. tjmax: maximum junction temperature=150[ ], ta: peripheral temperature [], ja : thermal resistance of package-ambience[ /w], pd : package power dissipation [w], pc: power dissipation [w], vcc: input voltage, vo : output voltage, io: load, ib : circuit current package power dissipation : pd (w) = (tjmax-ta) / ja power dissipation : pc (w) = (vcc-vo) io+vccib 10. vcc pin insert a capacitor with a capacitance of 1 f or higher between the vcc and gnd pins. choose the capacitance according to the line between the power smoothing circuit and the v cc pin. selection of the ca pacitance also depends on the application. verify the application and allow for sufficient margins in the design. we recommend using a capacitor with excellent voltage and tem perature characteristics. electric capacitance ceramic capacitors, low esr capacitor ic
datasheet datasheet 15/19 tsz02201-0t2t0an00090-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.feb.2013 rev.001 BD80C0AFPS-M bd90c0afps-m 9.0vvcc 26.5v (BD80C0AFPS-M) 10.0v vcc 26.5v (bd90c0afps-m) -40 ta +105 1f cin 100f 1f cout 100f 9.0vvcc 26.5v (BD80C0AFPS-M) 10.0v vcc 26.5v (bd90c0afps-m) -40 ta +105 0a i o 1a cout_esr vs io(reference data) cin vs cout(reference data) operation note 11 measurement circuit vcc vo gnd cin (1f or higher) esr io(rout) ( 0.001 or higher) vcc cout( 1 f or higher) 1 10 100 1 10 100 coutf cinf stable operating region 0.001 0.01 0.1 1 10 100 0 200 400 600 800 1000 io(ma) cout_esr (? stable operating region unstable operating region 11. output pin in order to prevent oscillation, a capacitor needs to be placed between the output pin and gnd pin. we recommend a capacitor with a capacitance of more than 1 f. electrolytic, tantalum and ceramic capacitors can be used. when selecting the capacitor ensure that the capacitance of more than 1 f is maintained at the intended applied voltage and temperature range. due to changes in temperature, the capacitance can fluctuate possibly resulting in oscillation. for selection of the capacitor refer to the cout esr vs. io. the stable operation range given in the reference data is based on the standalone ic and resistive load. for actual applications the stable operating range is influenced by the pcb impedance, input supply impedance and load impedance. theref ore verification of the final operating environment is needed. when selecting a ceramic type capacitor, we recommend using x5r, x7r or better with excellent temperature and dc-biasing characteristics and high voltage tolerance. also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying that the actual application meets with the required specification. 12. rapid variation in vcc voltage and load current in case of a rapidly changing input voltage, transients in the output voltage might occur due to the use of a mosfet as output transistor. although the actual application might be the cause of the transients, the ic input voltage, output current and temperature are also possible causes. in case prob lems arise within the actual operating range, use countermeasures such as adjusting the output capacitance. 13. minute variation in output voltage in case of using an application susceptible to minute changes to the output voltage due to noise, changes in input and load current, etc., use countermeasures such as implementing filters. 14. over current protection circuit (ocp) this ic incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit.
datasheet datasheet 16/19 tsz02201-0t2t0an00090-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.feb.2013 rev.001 BD80C0AFPS-M bd90c0afps-m 15. thermal shutdown circuit (tsd) this ic incorporates and integrated thermal shutdown circuit to prevent heat damage to the ic. normal operation should be within the power dissipation rating, if however the rating is exceeded for a continued period, the junction temperature (tj) will rise and the tsd circuit will be activated and turn all output pins off. after the tj falls below the tsd threshold the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 16. in some applications, the vcc and pin potential might be reversed, possibly resulting in circuit internal damage or damage to the elements. for example, while the external capacitor is charged, the vcc shorts to the gnd. use a capacitor with a capacitance with less than 1000 f. we also recommend using reverse polarity diodes in series or a bypass between all pins and the vcc pin. 17. this monolithic ic contains p+ isolation and p substrate la yers between adjacent elements in order to keep them isolated. p/n junctions are formed at the intersection of these p layers with the n layers of other elements to create a variety of parasitic elements. for example, in case a resistor and a transistor are connected to the pins as shown in the figure below then: the p/n junction functions as a parasitic diode when gnd > pin a for the resistor, or gnd > pin b for the transistor. also, when gnd > pin b for the transistor (npn), the parasitic diode described above combines with the n layer of the other adjacent elements to operate as a parasitic npn transistor. parasitic diodes inevitably occur in the structure of the ic. their operation can result in mutual interference between circuits and can cause malfunctions and, in turn, physical dam age to or destruction of the chip. therefore do not employ any method in which parasitic diodes can operate such as applying a voltage to an input pin that is lower than the (p substrate) gnd.
datasheet datasheet 17/19 tsz02201-0t2t0an00090-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.feb.2013 rev.001 BD80C0AFPS-M bd90c0afps-m marking diagrams to252s-3 (top view) part number marking lot number 80c0a to252s-3 (top view) part number marking lot number 90c0a
datasheet datasheet 18/19 tsz02201-0t2t0an00090-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.feb.2013 rev.001 BD80C0AFPS-M bd90c0afps-m physical dimension, tape and reel information package name to252s-3 direction of feed 1pin reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the lower left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 ( )
datasheet datasheet 19/19 tsz02201-0t2t0an00090-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 21.feb.2013 rev.001 BD80C0AFPS-M bd90c0afps-m revision history date revision changes 21.feb.2013 001 new release
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. notice general precaution 1. before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2. all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1. if you intend to use our products in devices requirin g extremely high reliability (such as medical equipment, aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. other precaution 1. the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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